Electro-mechanical integration and packaging
Combining mechanical and electrical systems into manufacturable products. We handle thermal management, connector selection, cable routing, and the interface documentation that keeps both disciplines aligned.
Problems we solve
Integration issues often surface late when they're expensive to fix. We address the common disconnects between electrical and mechanical development.
What you receive
Documented outputs that both electrical and mechanical teams can work from.
Integrated assembly models
3D models combining mechanical structure with electrical components, harnesses, and enclosures
Interface control documents (ICD)
Formal specifications defining electrical-mechanical boundaries, pinouts, and mounting requirements
Thermal analysis reports
Heat load calculations, CFD results, and cooling strategy recommendations with documented assumptions
Cable and harness routing layouts
Routed harness designs with bend radius compliance, length estimates, and breakout locations
Connector specifications
Connector selection matrices considering pin count, current rating, IP rating, and mating cycles
EMC/EMI design guidelines
Shielding recommendations, grounding strategies, and layout guidelines for electromagnetic compatibility
Our approach
A structured process that catches integration issues early.
Interface definition
Establish clear boundaries between electrical and mechanical subsystems. Document power, signal, and thermal interfaces with agreed specifications.
Integrated layout
Develop packaging concepts that address component placement, routing paths, and thermal management. Resolve space conflicts early.
Thermal and EMC review
Analyze heat dissipation paths, validate cooling strategies, and assess electromagnetic compatibility risks before detailed design.
Documentation and handoff
Produce interface control documents, assembly drawings, and integration procedures that both disciplines can build from.
Tools and standards
We use industry-standard tools and follow recognized standards for integration work.
ECAD-MCAD Integration
- ECAD/MCAD bidirectional exchange
- IDX and IDF file formats
- Component placement synchronization
- Keep-out zone management
Thermal Analysis
- CFD simulation (FloEFD, Ansys Icepak)
- Conduction network modeling
- Heat sink sizing and optimization
- Fan curve analysis
Routing and Harness
- 3D harness routing
- Bend radius verification
- Length and weight estimation
- Breakout documentation
Standards
- IPC-2221 (PCB design)
- MIL-STD-810 (environmental)
- IEC 61000 (EMC)
- IP ingress ratings
Representative engagements
Examples of how we've helped teams solve electro-mechanical integration challenges.
Industrial control cabinet thermal redesign
Challenge
Existing cabinet design experienced thermal shutdowns during summer operation. Customer needed a solution without changing the enclosure footprint.
Approach
Conducted thermal mapping of existing cabinet, identified heat concentration zones, and modeled alternative cooling strategies. Implemented ducted airflow with strategic component relocation.
Outcome
Reduced internal temperature rise by 18C while maintaining IP54 rating. No thermal shutdowns reported after 12 months of field operation.
Sensor module packaging for harsh environment
Challenge
Multi-sensor module required integration of electronics, optics, and mechanical mounting in a sealed enclosure rated for outdoor use.
Approach
Developed integrated packaging concept addressing thermal management, cable egress, and seal design. Created ICD linking optical alignment requirements to mechanical tolerances.
Outcome
Delivered production-ready package meeting IP67 and operating temperature range of -40C to +85C. Passed HALT testing on first attempt.
Common questions
Do you work directly with our ECAD team?
Yes. We coordinate with your electrical engineers to ensure mechanical and electrical designs stay synchronized. We can work with common ECAD outputs (ODB++, IDF, IDX) and participate in cross-functional design reviews.
What thermal analysis software do you use?
We use FloEFD and Ansys Icepak for CFD-based thermal simulation. For simpler conduction-dominated problems, we may use analytical methods or spreadsheet-based models. The approach depends on the accuracy needed and project timeline.
Can you help with connector selection?
Yes. We evaluate connectors based on electrical requirements (pin count, current, voltage), mechanical constraints (space, orientation, mating force), environmental factors (IP rating, temperature), and lifecycle considerations (mating cycles, serviceability).
How do you handle EMC early in design?
We apply design-for-EMC principles during layout: proper grounding, shielding effectiveness, cable routing to minimize coupling, and filtering locations. This reduces the risk of surprises during compliance testing.
What if we only have a partial electrical design?
We can work with preliminary specifications and update the mechanical integration as the electrical design matures. Interface control documents help manage changes across both disciplines.
Need electro-mechanical integration support?
Tell us about your integration challenge. We'll scope the work and provide a clear path forward.
Request engineering support